First an organic planarization layer is spin-coated on a substrate. Next a low viscosity, photo-polymerizable imprint solution is dispensed as droplets on the wafer, forming an etch barrier in the imprint area (Step A). The template is then lowered into liquid-contact with the substrate, displacing the solution, filling the imprint field, and trapping the photo-polymerizable imprint solution in the template relief (Step B). Irradiation with UV light through the backside of the template cures the solution (Step C). The template separates from the substrate, leaving an organo-silicon relief image that is an exact replica of the template pattern (Step D). A short halogen etch is used to clear undisplaced, cured imprint solution. A subsequent oxygen reactive ion etch into the planarization layer amplifies the aspect ratio of the imprinted image.