Enabling Nano-Scale Technology in Manufacturing
Technology


Q:
Can Imprio® systems be used for R&D?
A:
Yes. MII tools can also be used in small volume manufacturing and process development.

Q: How long can one template be used?
A: Using a single template (imprint mask), MII has demonstrated greater than 4000 imprints containing sub-100nm features. The template can be easily cleaned and reconditioned for additional imprinting.

Q: Is it possible to use soda lime glass as the template material?
A: Soda lime glass has poor thermal qualities. Fused silica is preferred and recommended.

Q: What kind of chemical(s) do you use for the release layer on the template?
A: This is a proprietary MII material.

Q: What kind of photo-resist is used for the UV curable imprint liquid?
A: MII has created a proprietary low viscosity material optimized for S-FIL® applications.

Q: Can the photoresist overflow the template mesa?
A: No. Capillary forces and the template configuration confine the low-viscosity material to within the active imprint field.

Q: What is the max/min aspect ratio of features patterned by S-FIL® systems?
A: Post-etch is about 10:1. Pre-etch is 3:1.

Q: What is the variation of template pattern depth?
A: The pattern is etched into a template to a depth of ~100nm. This is an optimized depth to provide subsequent pattern transfer for etching as well as adequate time for capillary forces of the monomer fluid to fill the relief structure.

Q: How large is the alignment mark?
A: The marks continue to be optimized. The current marks are competitive in overall size.

Q: How does the tool know when the resist has completely filled the template?
A: MII uses capillary forces to ensure the relief structure is filled. The Imprio tools use an optical scope to approximately determine when an image is filled.

Q: When can a 30nm template be available?
A: MII is working with several commercial mask shops and individual research organizations to improve the template infrastructure. On a research level, 30nm has been demonstrated.

Copyright 2008