S-FIL/R technology is an enhanced, reverse tone imprint process from the standard S-FIL^® technology. The S-FIL/R process uses an organic imprint fluid on top of a pre-planarized substrate. An additional silicon-containing coating is then applied to the imprinted layer. This topcoat material, SilSpin™, can be readily designed to incorporate ultra high (>20%) silicon by weight.

The basic steps are the same as those for the S-FIL process, except that an organic rather than silicon containing imprint fluid is used (Steps 1-4). After imprinting, a spin-on, planarizing, silicon-containing material is applied, using standard coater equipment (Step 5).

The SilSpin is isotropically halogen etched, just until the feature tops of the organic imprint are exposed (Step 6). A subsequent oxygen etch into the imprinted layer amplifies the aspect ratio of the image (Step 7).